CPU-Z TXT Report
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Binaries
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CPU-Z version 1.57
Processors
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Number of processors 1
Number of threads 1
APICs
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Processor 0
-- Core 0
-- Thread 0 0
Processors Information
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Processor 1 ID = 0
Number of cores 1 (max 1)
Number of threads 1 (max 1)
Name AMD V140
Codename Champlain
Specification AMD V140 Processor
Package Socket S1 (63
CPUID F.6.3
Extended CPUID 10.6
Brand ID 4
Core Stepping DA-C3
Technology 45 nm
TDP Limit 25 Watts
Core Speed 2294.2 MHz
Multiplier x FSB 11.5 x 199.5 MHz
HT Link speed 1596.0 MHz
Stock frequency 2300 MHz
Instructions sets MMX (+), 3DNow! (+), SSE, SSE2, SSE3, SSE4A, x86-64, AMD-V
L1 Data cache 64 KBytes, 2-way set associative, 64-byte line size
L1 Instruction cache 64 KBytes, 2-way set associative, 64-byte line size
L2 cache 512 KBytes, 16-way set associative, 64-byte line size
Thread dumps
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CPU Thread 0
APIC ID 0
Topology Processor ID 0, Core ID 0, Thread ID 0
Type 02004000h
Max CPUID level 00000005h
Max CPUID ext. level 8000001Bh
Cache des*****or Level 1, I, 64 KB, 1 thread(s)
Cache des*****or Level 1, D, 64 KB, 1 thread(s)
Cache des*****or Level 2, U, 512 KB, 1 thread(s)
Chipset
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Northbridge AMD 785GX rev. 00
Southbridge AMD SB800 rev. 40
Memory Type DDR3
Memory Size 4096 MBytes
Channels Dual, (Unganged)
Memory Frequency 532.0 MHz (3:
CAS# latency (CL) 7.0
RAS# to CAS# delay (tRCD) 7
RAS# Precharge (tRP) 7
Cycle Time (tRAS) 20
Bank Cycle Time (tRC) 27
Command Rate (CR) 1T
Uncore Frequency 1596.0 MHz
Memory SPD
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DIMM # 1
SMBus address 0x50
Memory type DDR3
Module format SO-DIMM
Manufacturer (ID) Hyundai Electronics (AD00000000000000)
Size 2048 MBytes
Max bandwidth PC3-10700 (667 MHz)
Part number HMT325S6BFR8C-H9
Serial number 0B90A440
Manufacturing date Week 46/Year 10
Number of banks 8
Nominal Voltage 1.50 Volts
EPP no
XMP no
JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 5.0-5-5-14-19 @ 380 MHz
JEDEC #2 6.0-6-6-17-23 @ 457 MHz
JEDEC #3 7.0-7-7-20-27 @ 533 MHz
JEDEC #4 8.0-8-8-22-30 @ 609 MHz
JEDEC #5 9.0-9-9-25-34 @ 685 MHz
1
SMBus address 0x50
Memory type DDR3
Module format SO-DIMM
Manufacturer (ID) Hyundai Electronics (AD00000000000000)
Size 2048 MBytes
Max bandwidth PC3-10700 (667 MHz)
Part number HMT325S6BFR8C-H9
Serial number 0B90A440
Manufacturing date Week 46/Year 10
Number of banks 8
Nominal Voltage 1.50 Volts
EPP no
Monitoring
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Mainboard Model 1604 (0x000000CB - 0x00002160)
LPCIO
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Hardware Monitors
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Hardware monitor ACPI
Temperature 0 92°C (197°F) [0xE44] (THRM)
Hardware monitor Battery
Voltage 0 12.54 Volts [0x30FD] (Current Voltage)
Capacity 0 48038 mWh [0xBBA6] (Designed Capacity)
Capacity 1 48038 mWh [0xBBA6] (Full Charge Capacity)
Capacity 2 48038 mWh [0xBBA6] (Current Capacity)
Level 0 n.a. [0x64] (Wear Level)
Level 1 100 pc [0x64] (Charge Level)
DMI
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DMI BIOS
vendor Hewlett-Packard
version F.06
date 11/08/2010
DMI System Information
manufacturer Hewlett-Packard
product Presario CQ56 Notebook PC
DMI Baseboard
vendor Hewlett-Packard
model 1604
revision 88.06
serial PX2U0011ZZSD7Z
DMI System Enclosure
manufacturer Hewlett-Packard
chassis type Notebook
chassis serial None
DMI Processor
manufacturer AMD processor
model AMD V140 Processor
clock speed 2300.0 MHz
FSB speed 200.0 MHz
multiplier 11.5x
DMI Physical Memory Array
location Motherboard
usage System Memory
correction None
max capacity 8192 MBytes
max# of devices 2
DMI Memory Device
designation Bottom - Slot 1 (top)
format SODIMM
type unknown
total width 64 bits
data width 8 bits
size 2048 MBytes
DMI Memory Device
designation Bottom - Slot 2 (under)
format SODIMM
type unknown
total width 64 bits
data width 8 bits
size 2048 MBytes
Graphics
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Number of adapters 1
Graphic APIs
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API ATI I/O
API ADL SDK
Display Adapters
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Display adapter 0
Name AMD M880G with ATI Mobility Radeon HD 4250
Memory size 256 MB
GPU ref clock 27000
PCI device bus 1 (0x1), device 5 (0x5), function 0 (0x0)
Vendor ID 0x1002 (0x103C)
Model ID 0x9712 (0x1604)
Performance Level 0
Software
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Windows Version Microsoft Windows 7 (6.1) Home Premium Edition (Build 7600)
DirectX Version 11.0